If you design or integrate semiconductors in your product, you are under pressure at all times to make smaller, faster, smarter chip products. Every millimeter of surface area is critical, and heat and energy efficiency can mean the difference between survival and dominance.

By applying FLITE’s technique to packaging surfaces, we can improve the passive evacuation of heat from the surface, so that cooling energy can be reduced, packaging can be smaller, and the savings can translate to faster clocking or lower energy draw.